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Guilin Lasercom Technologies Co., Ltd.

JOINT VENTURE

· GLSUN Science and Tech Co.LTD , CHINA

· AGX TECHNOLOGIES, INC., USA

 

GOAL

· BECOME THE PREMIER LASER DIODE MANUFACTURER IN CHINA.

 

LASERCOM STRENGTHS

· Staff with strong combination of proven experience in design and production of high performance and high volume laser diode chips.

· Many proprietary designed tools and processes improve yields and throughput relative to competitors.

· Experienced in both BH and Ridge designs and processing.

· BH for high performance & Ridge for lower cost.

 

WAFERFAB DESIGN

· Designed from ground up for manufacturing efficiency in laser diodes.

· Initial target DFB chip capacity 2KK/month.

· Low operating cost & High efficiency layout.

· State of art design, optimized for manufacturing semiconductor laser diodes.

· Heavy use of automated/semi-automated processing equipment.

· Initial target DFB chip capacity 2KK/month.

· Expandable to 5KK/month with additional equipment.

 

EXPERIENCED ENGINEERING & MANAGEMENT

· Engineering, R&D and management staff previous accomplishments.
· Held primary production roles in Finisar, Ortel/Emcore and Archcom waferfabs.

· Built two waferfabs for laser diode manufacturing in USA.

· Created world leading manufacturing facility and business in pointer lasers.

 

 

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